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退火溫度對(duì)ARB超細(xì)晶銅室溫拉伸斷裂行為的影響

2017-05-16 09:02來(lái)源:中鏨集團(tuán)SinoAV作者:通項(xiàng)公司TXCO網(wǎng)址:http://www.wypoker.cn/ 

退火溫度對(duì)ARB超細(xì)晶銅室溫拉伸斷裂行為的影響Effect of annealing temperature on tensile fracture behavior of ARB ultrafine grained copper at room temperature

研究退火溫度對(duì)累積疊軋法(ARB)制備的超細(xì)晶銅室溫拉伸斷裂行為的影響. 利用透射電子顯微技術(shù)(TEM)觀察制備態(tài)超細(xì)晶銅的微觀結(jié)構(gòu), 在單軸疲勞試驗(yàn)機(jī)(IBTC-5000)上對(duì)制備態(tài)及不同溫度退火態(tài)的樣品進(jìn)行單向靜態(tài)拉伸實(shí)驗(yàn), 通過(guò)掃描電子顯微技術(shù)(SEM)觀察力學(xué)測(cè)試后試樣的斷口形貌. 研究發(fā)現(xiàn):在實(shí)驗(yàn)溫度范圍內(nèi)退火處理均使ARB-Cu的屈服強(qiáng)度和抗拉強(qiáng)度下降, 當(dāng)退火溫度低于再結(jié)晶溫度時(shí), 超細(xì)晶銅的屈服強(qiáng)度和抗拉強(qiáng)度均隨退火溫度的升高而升高;當(dāng)退火溫度高于再結(jié)晶溫度時(shí), 其強(qiáng)度迅速下降. 綜上所述, 當(dāng)退火溫度為200 ℃時(shí), 超細(xì)晶銅的屈服強(qiáng)度和抗拉強(qiáng)度達(dá)到退火態(tài)最大值;斷口形貌的觀察表明, 退火處理有助于ARB材料焊合界面結(jié)合強(qiáng)度的提高, 且退火溫度越高, 焊合界面結(jié)合性能越好. 焊合界面經(jīng)歷的疊軋道次越多, 結(jié)合效率就越高, 其關(guān)系滿足公式E = (1- 0.5^n) × 100% .

The effect of annealing temperature on the tensile fracture behavior of UFG copper was studied. The microstructure of the initial specimen was observed by using transmission electron microscope (TEM) technique. The uniaxial static tensile test was performed by utilizing fatigue test machine (IBTC-5000). Fracture morphology was observed by scanning electron microscopy (SEM). The yield strength and tensile strength of ARB-Cu decreased after annealing treatment compared with initial sample. However, the yield strength and tensile strength of UFG copper increased with increasing annealing temperature below the recrystallization temperature. When annealing temperatures were higher than recrystallization temperature, the strength decreased rapidly. A general rule could be summarized as follows: the yield strength and tensile strength of UFG copper climbed to the peak when the annealing temperature was 200 ℃. From the fracture morphology, annealing treatment was beneficial to the enhancement of the interface bonding strength of ARB materials. The higher annealing temperature is, the better performance of bonding interface. With increasing interface bonding after ARB, the bonded efficiency was higher, in which the relation obeyed the formula: E = (1- 0.5^n) × 100%.

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